ECMP

Embedded Multi-Chip Package Memory (eMCP) is a technology that integrates eMMC (Embedded Multimedia Card) and LPDDR (Low Power Double Data Rate DRAM) into a compact multi-chip package. This package is designed to improve memory and memory integration, reduce board footprint, and improve overall performance and reliability.
Key Features and Benefits:
1. High integration: By encapsulating eMMC and LPDDR together, eMCP reduces the area occupied by the PCB substrate, making smart devices more miniaturized and thinner.
2. Space-saving: eMCPs are especially suitable for space-constrained devices such as smartphones, tablets, wearables, and Internet of Things (IoT) devices.
3. Performance improvement: eMCP adopts an isolated design, which effectively reduces signal interference and stabilizes the data transmission rate, thereby improving the overall performance of the chip.
4. Low power consumption: Due to the integration of low-power DRAM, eMCPs excel in battery-powered applications such as wearables and mobile IoT products.
5. Simplified Design: eMCP simplifies PCB design, reduces bill of materials (BOM) complexity, and provides a variety of firmware configurations to suit different application needs.